Specification
| Item | Details |
|---|---|
| X-ray tube | Mo/Rh/W/Ag Target(Option), 50kVp, 1mA |
| Detection System | FSDD (Fast silicon draft Detector) |
| Energy Resolution | Si type Detector(FSDD) 122eV FWHM at Mn Kα |
| Collimator | Poly capillary optics(Focal Spot 15um/30um) FWHM |
| Detection Element | Ti(22)~U(92) |
| Sample Type | Wide PCB |
| Equipment Size | 2600 X 1350 X 2050mm (WXDXH) 415X510mm PCB / 810X610mm PCB |
| Measurable PCB Size | 415X510mm610X510mm
810X610mm (W×D) |
| Utility |
Power : Single-Phase 220V, 4kw Air Pressure : 5kgf |
| Key Features |
Plating thickness measurement general, Rh, Pd, Au, Ag, Sn, Ni Film thickness measurement of multilayer thin films (up to 5 Layer) |
| Camera Magnification | 40~80 x |
| Safety device of Radioactivity | Cut-off device for an automatic 3 |
| Type of Report |
Excel, PDF / output Custom form |
| Key Benefits |
Film thickness measurement of multilayer thin films (up to 5 Layer) Convenient stage control Multi-Point measurement possible |
| Application |
ENIG, ENEPIG, HDI Electronic circuit board (PCB) The analysis of the exact content when measuring plating thickness |