iEDX-150μT
Specification
| Item | Details |
|---|---|
| X-ray tube | Mo/Rh/W/Ag Target(Option), 50kVp, 1mA |
| Detection System | FSDD(Fast Silicon Draft Detector) |
| Energy Resolution | Si type Detector(FSDD) 122eV FWHM at Mn Kα |
| Collimator | Poly capillary optics(Focal Spot 15um/30um) FWHM |
| Detection Element | Ti(22)~U(92) |
| Sample Type | Solid / Liquid / Powder, Multi-Layer |
| Size of the sample chamber | 660mmX450mmX150mm / 500mmX450mmX150mm |
| Sample stage moving possible distance |
300mmX200mmX150mm / 220mmX200mmX150mm |
| Size of the sample table | 310mm X 260mm |
| Key Features |
Auto / Manual Stage Mode Plating thickness measurement : General, Rh, Pd, Au, Ag, Sn, Ni Film thickness measurement of multilayer thin films (up to 5 Layer) |
| Camera Magnification | 40~80 x |
| Safety | 3 point interlock |
| Type of Report |
Excel, PDF / output Custom form |
| Key Benefits |
Micro focused measuring point(<70um) using capillary optics Film thickness measurement of multilayer thin films (up to 5 Layer) Convenient stage control Multi-point measurement possible Remote Support by on line |
| Application |
Plating thickness measurement special, ENEPIG, Pd-Ni, Rh etc. Plating analysis automobile parts, Electronic circuit board(PCB), Such as a capacitor Analysis of single-layer, Multi-layer, Alloy plating Thickness with Composition Ratio can be measure on time in alloy plating |